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诺森柔封装工艺建模与应用YongAn9787030625052科学出版社
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ContentsAbbreviations1 Advanced Electronic Packaging 11.1 Introduction 11.2 Adhesively Bonde Mtlayer Structure 51.3 Interfacial Peeling-off 61.3.1 Needle Ejecting for Thin Chips 61.3.2 Conformal Peeling for Large-Area Devices 81.3.3 LLO for Large-Area Flexible Electronics 91.4 Vacuum-Based Chip Picking-up 121.5 Vacuum-Based Chip Placing-on 131.6 Comig Fracture 161.6.1 Comig Fracture Behavir 61.6.2 Fracture Strength and Adhesive Fracture Energy 16References 172 Interfacial Modeling of Flexible Multilayer Structures 292.1 Introduction 292.2 Modeling of Chip-on-Substrate Structure 292.2.1 Mechanical Model 292.2.2 Analytical Evaluation on ERR of Interfacial Peeling 312.. Virtual Crack Closure Technique (VCCT 332.2.4 Numerical Model 34. Modeling of Chip-Adhesive-Substrate Adhesively Bonded Joints 34..1 Adhesive Model on Overlapped Joints 34..2 Equilibrium Equations 36.. Establishment of Differential Equation Set 38..4 Solutions for Internal Forces and Displacements 40..5 Relationships Among Integration Constants 44.. Theoretical Calculation of ERR of Interfacial Peeling 462.4 Summary 46References 473 Measurement of Fracture Strength of Ultra-Thin Silicon Chip and Adhesive Fracture Energy 493.1 Introduction 493.2 Fracture Strength of Ultra-Thin Silicon Chip 503.2.1 Experimental Procedure 503.2.2 Nonlinear Mechanical Characterization in Bending Test 513.. Estimation of Fracture Strength 583.3 Estimation of Adhesive Fracture Energy of Adhesive Tape 623.3.1 Theoretical Foundation 623.3.2 Experimental Procedure 643.3.3 Estimation of Adhesive Fracture Energy 643.3.4 Angle Dependence of Peel Force 653.3.5 Rate Dependence of Adhesive Fracture Energy 673.4 Summary 69References 704 Tension-Assisted Peeling 734.1 Introduction 734.2 Theoretical Determination of Integration Constants 734.2.1 Stiffened Plate Joint Under Axial Tension and Bending Moment 744.2.2 Single-Strap Joint Under Tension 764.. Single-Lap Joint Under Tension 794.3 Modeling of Adhesively Bonded Chip Array 824.3.1 Mechanical Model Description 824.3.2 Boundary and Continuity Conditions 844.3.3 Solution for Internal Forces and Displacements 854.3.4 Determination of Integration Constants 864.4 Adhesive Stresses for Adhesively Bonded Joints 874.4.1 Analysis of Balanced Adhesively Bonded Joints 874.4.2 Analysis of Unbalanced Adhesively Bonded Joints 904.4.3 Discussion of Results 924.5 Peeling Behavior for Chip Array on Stretched Substrate 934.5.1 Adhesive Stresses 934.5.2 Effect of Geometric Dimensions 954.5.3 Effect of Material Properties 984.5.4 Process Optimization 1004.6 Summary 101References 1025 Single-Needle Peeling 1055.1 Introduction 1055.2 A Case for Chip-on-Substrate Structure 1075.2.1 EfiFect of Crack Length 1085.2.2 Effect of Geometric Dimensions 1085.. Effect of Elastic Mismatch 1105.3 A Case for Chip-Adhesive-Substrate Structure 1115.3.1 Geometric Model Description 1115.3.2 Theoretical Calculation of ERR 1155.33 Effect of Crack Length 1165.3.4 Effect of Geometric Dimensions 1175.3.5 Effect of Material Properties 1185.3.6 Analysis on Tunability of Peeling Mode 1195.4 Analysis of Fracture Mode Based on Comig Index 1215.4.1 Typical Fracture Modes 1215.4.2 Comig Fracture Model 15.4.3 Basic Fracture Parameters 1245.4.4 Effect of Geometric Dimensions 1255.4.5 Discussion on Results 1275.5 Impact Effect of Needle Peeling-off Process 1305.5.1 Failed Sample Observation 1305.5.2 Numerical Model 1305.5.3 Effect of Impact Speed 1325.5.4 Effect of Substrate Penetration 1345.6 Summary 135References 1376 Multi-Needle Peeling 1396.1 Introduction 1396.2 Mechanical Model of Multi-Needle Peeling-off 1406.2.1 Model Description 1406.2.2 Boundary and Continuity Conditions 1426.. Determination of Integration Constants 1446.3 Comig Fracture Model of Chip-Adhesive-Substrate Structure 1476.4 Analysis of Bending Normal Stress and ERR of Interfacial Peeling 1516.4.1 Analysis of Bending Normal Stress 1516.4.2 Analysis of ERR of Interfacial Peeling 1546.5 Effect of Chip Geometry on Comig Fracture Behavir 566.5.1 Effect of Chip Thickness 1566.5.2 Effect of Chip Length 1586.6 Experimental Validation 1606.7 Summary 162References 163Conformal Peeling 1657.1 Introduction 1657.2 Modeling of Conformal Peeling for Multilayer Structure 1667.3 Effect of Material Properties and Geometric Size 1747.3.1 Effect of Young’s Modulus of Device Layer 1747.3.2 Effect of Young’s Modulus of Adhesive Layer 1767.3.3 Effect of Device Thickness 1797.3.4 Effect of Substrate Thickness 181
转印是实现器件功能封装、产品包装必须要解决的核心工艺之一。面对日趋超薄化的芯片,实现其无损转印对于降低封装成本,提高产品成品率、改善器件可靠等有着显著意义。本书从建模、机理和工艺等方面入手,先针对单顶针和多顶针推顶剥离方式下的超薄芯片无损剥离技术进行了深入分析;接着,以器件层-粘胶层-载带层柔三层结构为对象,研究了基于卷到卷系统的辊筒共形剥离和卷到卷转移工艺;然后,针对厚度可能仅为几微米的更薄芯片,初步探索了更加和具有挑战的激光转移技术;之后,对目前关于转印技术的研究现状进行了总结分析;,对芯片真空拾取和贴装工艺进行了探讨,建立了真空拾取与高密度贴装的理论艺窗。
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