本书具有以下创新点:1.率先将多孔介质理论用于电子封装的热模拟分析,用于处理复杂的封装组件,如具有外绝缘层的TSV结构、微焊点和焊球阵列、具有多层结构和多种微通孔的基层,RDL层等,并应用于封装系统性能分析,可以有效解决封装热模拟仿真问题,大大缩短计算时间,并具有良好的模拟精度。
?2. 持续研究了3D芯片堆叠封装的热性能极限。随着3D封装的发热量上升,单纯的自然对流或者冷板技术不能实现有效热管理,采用直接液冷技术、或者背部微槽道液冷才能大幅度提高热设计功率,从而实现更高的芯片性能。
?3. 在新材料方面,作者引入碳纳米管作为3D互联TSV技术,分析其热性能和电性能,指出采用碳纳米管互联可以去除微焊点层,提高堆叠芯片之间的散热性能,从而缓解甚至消除热管理危机。同时,也对采用石墨烯、金刚石作为热扩散材料进行了阐述。
?4. 在可靠性测试与分析方面,内容涵盖了封装材料的本构模型及材料参数,广泛null
本书系统介绍了超摩尔时代优选封装理论模型、分析与新的模拟结果。内容涉及2.5D、3D、晶圆级封装的电性能、热性能、热机械性能、散热问题、可靠性问题、电气串扰等问题,提出了基于多孔介质体积平均理论的建模方法并应用于日渐复杂的优选封装结构,以及模型验证、设计和测试,并从原理到应用对封装热传输进行了很好的介绍。同时,引入并分析了碳纳米管、金刚石镀层、石墨烯等新材料的应用性能。本书针对产品开发阶段封装的热管理年11应力管理方面进行了详细阐述,在封装性能测试、蒸汽层散热器、微槽道冷却、热电制冷等方面也有涉及。相应的试验测试和案例分析也便于读者提高对封装}生能表征和评估方法的理解。本书可作为从事微电子封装行业人员的参考资料,也可供高等院校相关专业研究生和高年级本科生学习参考。
Preface
Acknowledgments
About the authors
1 Introduction
1.1 Evolution of integrated circuit packaging
1.2 Performance and design methodology for integrated circuit packaging
References
Further reading
2 Electrical modeling and design
2.1 Fundamental theory
2.2 Modeling,characterization,and design of through-silicon via packages
References
3 Thermal modeling,analysis,and design
3.1 Principles of thermal analysis and design
3.2 Package-level thermal analysis and design
3.3 Numerical modeling
3.4 Package-level thermal enhancement
3.5 Air cooling for electronic devices with vapor chamber configurations
3.6 Liquid cooling for electronic devices
3.7 Thermoelectric cooling
References
4 Stress and reliability analysis for interconnects
4.1 Fundamental of mechanical properties
4.2 Reliability test and analysis methods
4.3 Case study of design-for-reliability
References
5 Reliability and failure analysis of encapsulated packages
5.1 Typical integrated circuit packaging failure modes
5.2 Heat transfer and moisture diffusion in plastics integrated circuit packages
5.3 Thermal-and moisture-induced stress analysis
5.4 Fracture mechanics analysis in integrated circuits package
5.5 Reliability enhancement in PBGA package
References
Further reading
6 Thermal and mechanical tests for packages and materials
6.1 Package thermal tests
6.2 Material mechanical test and characterization
References
7 System-level modeling,analysis,and design
7.1 System-level thermal modeling and design
7.2 Mechanical modeling and design for microcooler system
7.3 Codesign modeling and analysis for advanced packages
References
Appendix 1 Nomenclature
Appendix 2 Conversion factors
Index